Acquisition of Wood Flooring and Adhesives

The U.S. Department of State has issued solicitation 19JA8026Q0017 for the acquisition of wood flooring and adhesives to be used at the U.S. Embassy Housing Compound in Tokyo, Japan. This requirement is classified under NAICS 321999, All Other Miscellaneous Wood Product Manufacturing, and PSC 5510, Lumber and Related Basic Wood Materials. There is no set-aside designated for this procurement. The government intends to award a purchase order to the responsible company that submits the lowest-priced, technically acceptable quotation. While the agency may hold discussions with companies in the competitive range if necessary, the current intent is to award the contract based on initial quotations.

Quotations must be submitted electronically to the primary point of contact, Ayaka Ogawara, by the response deadline of March 27, 2026. Submissions are restricted to an email size of 15MB, with larger files requiring separate emails. Quoters are required to be registered in the System for Award Management (SAM) database prior to the final contract award. The place of performance is located in Minato-ku, Tokyo, Japan, under the supervision of Christopher G. Staff.

The solicitation includes four attachments: the original cover letter and Request for Quotations (RFQ) posted on February 27, 2026, and three subsequent amendments. Amendments 0001 and 0002 provided question and answer clarifications in March 2026, and Amendment 0003 was issued on March 25, 2026, for contracting officer approval. Detailed instructions for the submission of quotes and required documentation are contained within Section 3 of the RFQ.